Transistor technology for induction melting furnaces

dc.contributor.authorPavlovec, Václav
dc.date.accessioned2021-11-08T08:13:18Z
dc.date.available2021-11-08T08:13:18Z
dc.date.issued2021
dc.format2 s.cs
dc.format.mimetypeapplication/pdf
dc.identifier.citationProceeding of UIE 2021: XIX International UIE Congress on Evolution and New Trends in Electrothermal Processes. 1.-3.2021, Pilsen, Faculty of Electrical Engineering, University of West Bohemia, Czech Republic, 2021, p. 4-5.en
dc.identifier.isbn978-80-261-0930-3
dc.identifier.urihttp://hdl.handle.net/11025/45682
dc.language.isoenen
dc.publisherFaculty of Electrical Engineering, University of West Bohemiaen
dc.rights© IEEEen
dc.rights.accessopenAccessen
dc.subjecttavicí pececs
dc.subjecttranzistorová technologiecs
dc.subjectbipolární tranzistor s izolovaným hradlemcs
dc.subjectIGBTcs
dc.subject.translatedmelting furnacesen
dc.subject.translatedtransistor technologyen
dc.subject.translatedIGBTen
dc.subject.translatedInsulated Gate Bipolar Transistoren
dc.titleTransistor technology for induction melting furnacesen
dc.typekonferenční příspěvekcs
dc.typeconferenceObjecten
dc.type.statusPeer-revieweden
dc.type.versionpublishedVersionen

Files

Original bundle
Showing 1 - 2 out of 2 results
No Thumbnail Available
Name:
Proceeding_2021_final-4-5.pdf
Size:
775.77 KB
Format:
Adobe Portable Document Format
Description:
No Thumbnail Available
Name:
uvod_tiraz_obsah.pdf
Size:
1.99 MB
Format:
Adobe Portable Document Format
Description:
Plný text
License bundle
Showing 1 - 1 out of 1 results
No Thumbnail Available
Name:
license.txt
Size:
1.71 KB
Format:
Item-specific license agreed upon to submission
Description:

Collections