Phase change materials for thermal management of Ic packages

dc.contributor.authorFiala, Pavel
dc.contributor.authorBěhunek, Ivo
dc.contributor.authorSteinbauer, Miloslav
dc.contributor.editorUlrych, Bohuš
dc.date.accessioned2017-04-03T06:35:46Z
dc.date.available2017-04-03T06:35:46Z
dc.date.issued2007
dc.description.abstract-translatedThis paper deals with the application of phase change materials (PCM) for thermal management of integrated circuits as a viable alternative to active forced convection cooling systems.The paper presents an analytical description and solution of heat transfer, melting and freezing process in 1D which is applied to inorganic crystalline salts. There are also results of numerical simulation of real 3D model. These results were obtained by means of the finite element method (FEM). Results of 3D numerical solutions were verified experimentally.en
dc.format6 s.cs
dc.format.mimetypeapplication/pdf
dc.identifier.citationAMTEE ’07 : seventh international conference on Advanced Methods in the Theory of Electrical Engineering : September 10-12, 2007 [Pilsen, Czech Republic].en
dc.identifier.isbn978-80-7043-564-9
dc.identifier.urihttp://hdl.handle.net/11025/25795
dc.language.isoenen
dc.publisherUniversity of West Bohemiaen
dc.rights© University of West Bohemiaen
dc.rights.accessopenAccessen
dc.subjectzměna fázecs
dc.subjectmetoda konečných prvkůcs
dc.subjectteplocs
dc.subjectintegrovaný obvodcs
dc.subject.translatedphase changeen
dc.subject.translatedfinite element methoden
dc.subject.translatedheaten
dc.subject.translatedintegrated circuiten
dc.titlePhase change materials for thermal management of Ic packagesen
dc.typekonferenční příspěvekcs
dc.typeconferenceObjecten
dc.type.statusPeer-revieweden
dc.type.versionpublishedVersionen

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