Chip-level bonding for microelectronic components by induction sintering of micro structured Ag particles
Date issued
2021
Journal Title
Journal ISSN
Volume Title
Publisher
Faculty of Electrical Engineering, University of West Bohemia
Abstract
Description
Subject(s)
indukční vazba, balení na úrovni čipů, FE simulace
Citation
Proceeding of UIE 2021: XIX International UIE Congress on Evolution and New Trends in Electrothermal Processes. 1.-3.2021, Pilsen, Faculty of Electrical Engineering, University of West Bohemia, Czech Republic, 2021, p. 85-86.