Testování ohebnosti flexibilních elektronických prvků a systémů
| dc.contributor.author | Skřivan, Jan | |
| dc.contributor.editor | Fiřt, Jaroslav | |
| dc.date.accessioned | 2017-11-09T07:38:18Z | |
| dc.date.available | 2017-11-09T07:38:18Z | |
| dc.date.issued | 2017 | |
| dc.description.abstract-translated | This paper is focused on the design and realization of a bend test for flexible electronics. The proposed test method is then verified on the device. For this purpose, samples have been designed and implemented with SMD components connected by three different conductive adhesives. The results of the samples that are measured by four point method are then compared. | en |
| dc.format | 4 s. | cs |
| dc.format.mimetype | application/pdf | |
| dc.identifier.citation | FIŘT, Jaroslav ed. Elektrotechnika a informatika: XVIII. ročník konference doktorských prací Zámek Nečtiny, 26. – 27. října 2017. Vyd. 1. Plzeň: Západočeská univerzita v Plzni, 2017, s. [55-59]. | cs |
| dc.identifier.isbn | 978–80–261–0712–5 | |
| dc.identifier.uri | http://hdl.handle.net/11025/26452 | |
| dc.language.iso | cs | cs |
| dc.publisher | Západočeská univerzita v Plzni | cs |
| dc.rights | © Západočeská univerzita v Plzni | cs |
| dc.rights.access | openAccess | en |
| dc.subject | flexibilní elektronika | cs |
| dc.subject | flexibilní podklad | cs |
| dc.subject | test ohybu | cs |
| dc.subject.translated | flexible electronics | en |
| dc.subject.translated | flexible substrate | en |
| dc.subject.translated | bend test | en |
| dc.title | Testování ohebnosti flexibilních elektronických prvků a systémů | cs |
| dc.title.alternative | Flexibility testing of flexible electronic components and systems | en |
| dc.type | konferenční příspěvek | cs |
| dc.type | conferenceObject | en |
| dc.type.status | Peer-reviewed | en |
| dc.type.version | publishedVersion | en |
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